與JASM達成協(xié)議保障ADI的長期晶片供應(yīng)，並專注於40奈米及更先進製程節(jié)點

臺北2024年2月23日 /美通社/ -- Analog Devices, Inc. (Nasdaq: ADI)宣佈已與全球領(lǐng)先的專用半導(dǎo)體代工廠臺灣積體電路製造股份有限公司(TSMC)(以下稱臺積公司)達成協(xié)議，由臺積公司在日本熊本縣的控股製造子公司——日本先進半導(dǎo)體製造公司(JASM)提供長期晶片產(chǎn)能供應(yīng)。 

基於ADI與臺積公司長達超過30年的合作關(guān)係，此次達成之協(xié)議為ADI擴大先進製程節(jié)點的產(chǎn)能提供了更多選擇，進一步滿足ADI業(yè)務(wù)之關(guān)鍵平臺需求，包括無線BMS (wBMS)和GMSL? (Gigabit Multimedia Serial Link)應(yīng)用。雙方共同努力進一步鞏固ADI強韌的混合製造網(wǎng)路，有助於降低外部因素影響、快速擴大產(chǎn)能和規(guī)模，滿足客戶需求。

ADI全球營運與技術(shù)執(zhí)行副總裁Vivek Jain表示：「ADI的混合製造網(wǎng)路有助於為客戶提供競爭優(yōu)勢。與臺積公司合作使我們能為客戶提供更具韌性的供應(yīng)鏈，更快速回應(yīng)客戶需求及不斷變化的市場條件，並重點投資於造福社會和地球的創(chuàng)新製造解決方案?！?/p>

臺積公司北美業(yè)務(wù)發(fā)展執(zhí)行副總裁Sajiv Dalal表示：「臺積公司致力於協(xié)助客戶滿足其長期產(chǎn)能需求。我們很高興能夠擴大與ADI的持續(xù)合作，透過強勁的製造能力，實現(xiàn)堅定而充滿活力的半導(dǎo)體創(chuàng)新之旅。」

如需瞭解ADI具高度韌性之混合製造網(wǎng)路資訊，請瀏覽：www.analog.com/cn/who-we-are/resilient-hybrid-manufacturing.html。 

關(guān)於ADI公司

Analog Devices, Inc. (NASDAQ: ADI)為全球領(lǐng)先的半導(dǎo)體公司，致力於現(xiàn)實世界與數(shù)位世界間搭建橋樑，以實現(xiàn)智慧邊緣領(lǐng)域之突破性創(chuàng)新。ADI提供結(jié)合類比、數(shù)位和軟體技術(shù)之解決方案以推動數(shù)位化工廠、汽車和數(shù)位醫(yī)療等領(lǐng)域之持續(xù)發(fā)展，因應(yīng)氣候變遷挑戰(zhàn)，同時建立人與世界萬物的可靠互聯(lián)。ADI 2023會計年度營收超過120億美元，透過全球約2.6萬名員工，以及與全球12.5萬家客戶之攜手合作，致力協(xié)助創(chuàng)新者不斷超越一切可能。更多資訊請瀏覽www.analog.com 

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Forward-Looking Statements 

This press release contains forward-looking statements, which address a variety of subjects including, for example, our statements regarding our long-term wafer capacity supply arrangement with TSMC and JASM; our hybrid manufacturing network; and other future events. Statements that are not historical facts, including statements about our beliefs, plans and expectations, are forward-looking statements. Such statements are based on our current expectations and are subject to a number of factors and uncertainties, which could cause actual results to differ materially from those described in the forward-looking statements. The following important factors and uncertainties, among others, could cause actual results to differ materially from those described in these forward-looking statements: economic, political, legal and regulatory uncertainty or conflicts; changes in demand for semiconductor products; manufacturing delays, product and raw materials availability and supply chain disruptions; products that may be diverted from our authorized distribution channels; changes in export classifications, import and export regulations or duties and tariffs; our development of technologies and research and development investments; our future liquidity, capital needs and capital expenditures; our ability to compete successfully in the markets in which we operate; and security breaches or other cyber incidents. For additional information about factors that could cause actual results to differ materially from those described in the forward-looking statements, please refer to our filings with the Securities and Exchange Commission, including the risk factors contained in our most recent Annual Report on Form 10-K. Forward-looking statements represent management's current expectations and are inherently uncertain. Except as required by law, we do not undertake any obligation to update forward-looking statements made by us to reflect subsequent events or circumstances.

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